Company Introduction - Yixin Microelectronics - National High tech Enterprise Specialized and Innovative Enterprise

company profile

Company Profile

Yixin Microelectronics Technology (Shenzhen) Co., Ltd

Yichip Micro Semiconductor Technology (Shenzhen) Co., Ltd. was established on July 17, 2018, with a registered capital of 18 million RMB. It is a supplier specializing in solutions for memory particle packaging and testing, modules, AI sensor packaging and testing, and modules. The company is located at 2-5C, Zhongcheng Biomedical Industrial Park, No. 21 Linhui Road, Jinsha Community, Kengzi Street, Pingshan District, Shenzhen, offering convenient transportation and a beautiful environment.
The company focuses on the R&D, production, and sales of memory products, AI sensors based on SIP packaging and testing technology, advanced packaging and testing of memory and sensor products, and brand operations. It has built its own advanced packaging and testing production lines and module factories, specializing in memory chip packaging and testing, AI sensor chip packaging, multi-chip heterogeneous integration, QFN, WBBGA, FCBGA, and SiP, among other advanced packaging and testing fields. Its business spans six major areas: mobile smart terminals, PCs, smart homes, data centers, smart vehicles, and portable storage.
Yichip Micro Semiconductor Technology (Shenzhen) Co., Ltd. is a national high-tech enterprise and a national-level "specialized, refined, distinctive, and innovative" enterprise. It has successively obtained certifications for ISO 9001:2015 Quality Management System, ISO 14001 Environmental Management System, ISO 45001 Occupational Health and Safety Management System, and IATF 16949 International Automotive Quality Management System Standard. The company actively explores markets, continuously improves its R&D, production, and sales management systems, and is committed to building an advanced semiconductor chip packaging, testing, and module manufacturing enterprise, providing customers with a full-chain "one-stop" solution from chips to finished modules.