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  • work content ：
    1. Master the basic characteristics of mainstream packaging forms (QFN/BGA/CSP, etc.), and be able to identify the basic requirements for process adaptability in collaboration with core engineers based on chip types and customer needs, without deviating from the actual production conditions of the factory.  
    2. Understand the basic industry standards related to chip packaging (such as IPC basic specifications) and the core requirements of factory quality management systems (ISO9001), and be able to comply with regulations in work to ensure the compliance of auxiliary tasks.  
    3. Proficient in using office software (Excel, Word, PPT), able to accurately record experimental data, prepare basic reports (yield statistics, material consumption tables), and create simple charts (trend charts, comparison tables) to assist core engineers in data organization and analysis; familiar with the basic operations of professional software such as layout design and process simulation, and able to assist in file organization and basic checks.  
    4. Master the use of basic inspection tools (calipers, microscopes, multimeters, etc.), able to perform sample appearance checks, simple dimensional measurements, and basic electrical performance tests, accurately recording inspection results to provide foundational data for quality analysis.  
    5. Possess rigorous data analysis awareness, able to accurately record various data (process parameters, yield, equipment status, material consumption, defective products) during R&D experiments, pilot runs, and production support, ensuring data authenticity, completeness, and traceability without omissions or errors.  
    6. Able to perform basic classification, filtering, and summarization of recorded data, using Excel for data statistics to assist core engineers in identifying anomalies, supporting process optimization and project summaries.  
    7. Able to assist core engineers in drafting basic technical documents, such as initial versions of Standard Operating Procedures (SOPs), experiment reports, and material trial records, ensuring logical clarity, practical content, and compliance with factory documentation standards.  
    8. Possess document version management and archiving awareness, able to classify and archive R&D files, process materials, and equipment records, managing file versions systematically to avoid work errors caused by disorganized data and meet quality management system traceability requirements.



    Job requirements ：
    1. Education and Major: Bachelor's degree or above in Electronic Information, Electronic Packaging, Software Engineering, or related STEM fields.  
    2. Experience and Practice: 1-2 years of experience as a R&D assistant in a packaging factory, serving as a supporting role to core engineers in the R&D department (design, layout, front-end/back-end processes, project implementation, etc.). Focus on technical execution, data recording, production coordination, and basic R&D support for the full packaging process (front-end: dicing/die attach/wire bonding; back-end: molding/trim & form/test/sorting), ensuring R&D tasks are implemented and production technical support is delivered effectively while accumulating hands-on experience to enhance team efficiency in project advancement and process optimization.  
    3. Proactive Learning: Ability to quickly absorb foundational knowledge of chip packaging technology, equipment operation skills, and process optimization methods. Actively participate in internal technical training and knowledge sharing to gradually improve professional competence.  
    4. Practical Skill Development: Accumulate experience through practice, learn problem-solving approaches and project advancement logic from core engineers, and gradually develop the ability to independently handle simple technical issues and complete basic R&D support tasks, laying the groundwork for future promotion to core positions.  
    5. Industry Awareness: Understand basic industry trends and factory technical upgrade needs. Proactively learn foundational knowledge of new processes, equipment, and materials, assisting core engineers in preliminary research to align with factory development requirements.  
    6. Responsibility and Diligence: Strong sense of responsibility and meticulous work attitude, ensuring strict quality control in data recording, documentation, and hands-on operations to prevent oversights that may lead to errors or production risks.  
    7. Team Collaboration: Team-oriented mindset, actively cooperating with core engineers and team members to fulfill supporting tasks, stepping in when needed, and contributing to efficient R&D and production support efforts.



    Molding Process Engineer 

    work content ：
    1. Process development and optimization: Design and validate injection molding solutions for new packaging structures to enhance product performance or meet new requirements.  
    2. Material selection: Evaluate the flowability, thermal stability, and CTE compatibility of packaging materials such as epoxy resins and fillers, collaborating with suppliers to optimize formulations.  
    3. Quality and reliability control: Establish SPC control charts to monitor key parameter fluctuations in real-time, ensuring process stability.  
    4. Optimize packaging structures to adapt to injection molding processes, addressing molding defects during trial production.  
    5. Documentation and compliance management: Prepare SOPs, PFMEAs, control plans, and other documents to ensure compliance with standards such as IATF 16949.  
    6. Technological innovation and continuous improvement: Implement automation upgrades and other intelligent solutions.  
    Promptly complete ad-hoc tasks assigned by superiors or colleagues.


    Job requirements ：
    1. College degree or above.
    2. Proficient in the process flow and key parameter control of semiconductor packaging injection molding.
    3. Familiar with packaging failure analysis methods (SEM, X-ray, ultrasonic scanning).
    4. More than 3 years of experience in semiconductor packaging molding, familiar with mainstream packaging forms such as QFN, BGA, LGA.
    Research and Development Assistant Engineer
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  • Production and operation category
    WB technician 
    【work content 】
    1. Execute and operate the Wire Bond process in semiconductor packaging to ensure product quality meets standards;
    2. Operate and maintain Wire Bond equipment, perform daily inspections and simple troubleshooting;
    3. Assist engineers in adjusting and optimizing process parameters to improve production efficiency and product yield;
    4. Record and analyze production data, collaborate with the quality department for problem tracing and improvement.


    【Job requirements 】
    1. High school diploma or above, major not limited;
    2. 1-3 years of experience in Wire Bond or similar packaging processes, semiconductor industry experience preferred;
    3. Familiar with Wire Bond equipment operation procedures and basic equipment maintenance knowledge;
    4. Responsible and diligent, with good communication skills and team spirit.



    Molding technician 
    【work content 】
    1. Equipment Operation and Maintenance: Responsible for the daily operation of TOWA molding machines, accurately setting equipment parameters according to production plans and process requirements, starting the equipment for chip encapsulation molding production, and ensuring stable and efficient production processes.
    2. Production Process Control: Strictly follow process documents and operating instructions for molding production operations, control key process parameters such as molding temperature, pressure, and time to ensure product quality meets standard requirements. Record various parameters and data during the production process for subsequent quality traceability and analysis.
    3. Quality Control and Improvement: Conduct quality inspections on molded products, use measuring tools and testing equipment to check product dimensions, appearance, and performance, and determine product qualification based on quality standards. Identify, isolate, and record non-conforming products, analyze the causes of non-conformities, and propose improvement measures to prevent recurrence.
    4. Material and Tool Management: According to production plans and process requirements, receive and prepare materials required for molding production, such as plastic encapsulants, chip carriers, and molds. Check the quality and quantity of materials to ensure they meet production requirements. Properly store and manage materials to prevent moisture, oxidation, contamination, etc.


    【Job requirements 】
    1. Educational Background: College degree or above, preferably in mechanical automation or related fields; high school/vocational school graduates require at least 1 year of packaging industry experience.  
    2. Work Experience: Minimum 1-3 years of molding experience in semiconductor chip packaging, familiar with TOWA molding machine operation. Candidates with relevant project experience are preferred. Extensive industry experience enables technicians to quickly adapt to work pace, skillfully handle various production issues, and ensure continuity and stability.  
    3. Technical Skills: Proficient in operating, debugging, maintaining, and troubleshooting TOWA molding machines. Familiar with equipment parameter settings and capable of precise adjustments based on production needs to ensure efficient operation.  
    4. Competencies: Strong problem-solving and analytical skills. Able to promptly diagnose causes and propose effective solutions for sudden equipment failures or product quality issues during production.  
    5. Additional Requirements: Willingness to work shifts (semiconductor packaging typically involves continuous production for 24/7 operations). Physical fitness to handle demanding manual tasks, including lifting molds and heavy equipment components.

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  • Integrated Management
    Order Follow-up Specialist 
    【work content 】
    1. Responsible for order follow-up and management to ensure timely and quality completion of orders;  
    2. Communicate and coordinate with customers, production, and logistics departments to handle order-related issues;  
    3. Track order progress, promptly report abnormalities, and assist in resolving them;  
    4. Organize and maintain order-related documents to ensure accuracy of information.


    【Job requirements】
    1. College degree or above, major not limited, fresh graduates may also be considered;  
    2. Good communication skills and sense of responsibility, meticulous and conscientious work attitude;  
    3. Familiar with basic office software operations such as Excel, Word, etc.;  
    4. Strong learning ability, able to adapt to a fast-paced work environment.



    Material handler
    【work content 】
    1. Responsible for the receipt, issuance, and inventory management of materials required in the chip packaging production process;
    2. Assist in completing the classification, labeling, and arrangement of materials to ensure orderly storage;
    3. Cooperate with production line requirements to deliver materials accurately and timely;
    4. Conduct regular inventory checks to ensure consistency between accounts and physical stock, and promptly report any discrepancies.

    【Job requirements】
    1. No relevant work experience required, preference given to those with chip packaging industry background;
    2. Diligent and meticulous work attitude, responsible with good communication skills;
    3. Team player who can follow arrangements;
    4. (This position is for a production line material handler, not warehouse, day shift only)
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