English
中文
English
home page
Product Center
Service and Support
About Yixin Micro
Contact Us
Industry News
15307525582
home page
Product Center
Service and Support
About Yixin Micro
Contact Us
Industry News
15307525582
honors and qualifications
Honors and qualifications
Company Profile
Corporate Culture
Development History
production base
Honors and qualifications
Corporate Honors
高新技术企业证书
专精特新中小企业
智能制造能力成熟度标准符合性证书
创新型中小企业
智能制造能力成熟度标准符合性证书
产学研合作基地.png
一种半导体堆叠封装结构及其制备方法
一种指纹U盘与存储装置的封装方法与系统
一种指纹U盘与存储装置的封装方法与系统
智能自适应半导体封装测试优化方法及系统
一种指纹识别芯片封装体及其制备方法
一种半导体堆叠封装结构及其制备方法
Specialized, sophisticated, distinctive and innovative enterprises, national high-tech enterprises,
with intelligent manufacturing capability reaching level 3.
Company Profile
Company values
Development History
Production Base
Honor and Qualification
Design ability
Simulation capability
Laboratory
News and Information
Contact Us
Talent Recruitment
About Yixin Micro
Copyright© Yixin Micro Semiconductor Technology (Shenzhen) Co., Ltd;
Guangdong ICP No. 2025459454-1
Address: 5C, Building 2, Zhongcheng Biomedical Industrial Park, No. 21 Linhui Road, Jinsha Community, Kengzi Street, Pingshan District, Shenzhen
Phone: 15307525582
Email: sales@ychipway.com
Product Center
Service and Support
Industry News
Contact Us
QFN/QFP lead frame packaging;
LGA carrier board packaging
BGA packaging
Flip Chip Packaging
SIP system level encapsulation
Chiplet Heterogeneous Integration
Scan to add enterprise WeChat