Committed to becoming a benchmark enterprise for advanced 
packaging and testing driven product value

YCHIPWAY
YCHIPWAY

Storage packaging testing, module manufacturing, sensor 
packaging testing solution provider

YCHIPWAY

Research and development, testing, 
and module integration

National high-tech enterprise, national level specialized and innovative enterprise

The factory provides 7 × 24-hour technical support and 48 hour sample delivery to domestic customers, and simultaneously completes IECQ and RoHS international filing through local 
warehousing and compliance customs declaration processes. It can cooperate with customers to directly send packaged products to overseas production lines, reducing intermediate links
    • DFN/QFN lead frame packaing
      QFN package (square flat no pin package) and QFP package (square flat package): QFN and QFP packages based on copper lead frame, with a large exposed solder pad in the central area of the package for heat conduction, and conductive solder pads around the package periphery for electrical connection. Traditional chip packaging and integrated solutions with high reliability, high heat dissipation, and high density.

    • LGA carrier board packaging

      LGA (Land Grid Array) is a packaging technology that utilizes a planar array of metal contacts (pads) on the bottom of the chip to establish electrical connections with corresponding pads on a printed circuit board (PCB) through soldering (e.g., reflow soldering) or sockets (e.g., CPU sockets). This design leverages the advantages of short contact points and electrical pathways to optimize high-frequency signal transmission performance. Additionally, direct contact between the bottom metal pads and the PCB enhances heat dissipation efficiency while supporting higher-density pin layouts, making it suitable for highly integrated, high-performance integrated circuit packaging applications.
    • BAG packaging
      Ball Grid Array (BGA) packaging: The interconnection between the chip and substrate is achieved through wire bonding (die bond/wire bond) of conventional face-up chips or advanced hybrid packaging (Hybrid BGA) combining face-up and flip-chip technologies. An array of solder balls is arranged on the backside of the package substrate to serve as I/O terminals for connecting with printed circuit boards (PCBs).
    • Flip Chip Packaging
      The core of Flip Chip lies in bump technology. During the manufacturing process of chips, metal bumps (such as solder balls, copper pillars+tin caps, etc.) are deposited on the I/O pads, and then the chip is flipped over to align the bumps with the corresponding pads on the substrate, achieving interconnection through reflow soldering. This design distributes the I/O terminals across the entire chip surface, significantly improving packaging density and signal transmission efficiency.
      Fan-Out WLP
    • SiP system level packaging
      SiP (System in a Package): It has evolved from a conventional single chip with passive components to a multi chip multifunctional chip with passive components, covering hybrid packaging technologies including die bond/wire bond and flip chip, as well as other devices such as MEMS or optical sensor devices that are first assembled together to achieve a certain functional standard package, forming a system or subsystem.
    • Chiplet Heterogeneous Integration
      Heterogeneous chip engine adopts Chiplet microsystem architecture, which encapsulates 7nm computing chips, 28nm I/O chips, and HBM3D stack through UCIe high-speed interface at once, achieving a 40% performance improvement and a 35% cost reduction, providing reusable and scalable heterogeneous power for AI servers.
    01
    Core Technology
    Core Technology
    • 仿真设计

      Simulation Design

      We have industry-leading joint design simulation technology and are skilled in optimizing the design of advanced packaging materials and simulation data. Provide customers with SI/PI electrical performance analysis, product structure stress and reliability analysis, heat dissipation performance analysis and thermal resistance extraction, plastic packaging& Bottom filling adhesive mold flow filling analysis, as well as three-level collaborative Co Design design and simulation services for the joint chip end packaging end system end.
      •     Advanced Packaging Design Services
      •     Electrical performance simulation 
      analysis technology
      •     Structural stress simulation analysis
       technology
      •     SI/PI global electrical performance 
      verification; 
      •     Actuarial calculation of thermal resistance
       level heat dissipation performance; 
      •     Three level collaborative Co Design;
      •     Multi physics field stress reliability prediction; 
      •     Simulation optimization of rubber material 
      mold flow filling; 
      •     Packaging mold flow filling analysis
      •     Packaging heat dissipation simulation
       analysis technology
    • 先进制造

      Plastic encapsulation molding

      Place the epoxy resin encapsulation material particles in the injection channel of the mold, preheat them, and use the injection rod to transfer the melted epoxy resin into the mold cavity in a vacuum environment.
      •     Advanced plastic packaging and molding
       services
      •     Sealing thickness: 0.2-2.5mm Automatic 
      sealing; 
      •     Real time monitoring and predictive 
      maintenance; 
      •     Good Core Grain (KGD) system 
      yield>95%; 
      •     &2-week process switching, supporting
       small batches and multiple varieties; 
      •     Warpage < 30 µ M @ 300mm wafer;
      •     Unit wafer energy consumption reduced 
      by 25%, carbon emissions traceable; 
      •     SPC and traceability system zero defect 
      closed-loop management; 
      •     2.5-7.5mm manual sealing adhesive;
      •     High density, large substrate, and thin 
      thickness packaging; 
    • 品质保证

      Quality assurance

      Full process quality assurance runs through the entire product lifecycle, relying on a sound quality management system to ensure high-quality products from development to delivery and after-sales. Develop a quality plan during the development phase and extensively validate it; Comprehensive testing and simulation during the introduction of new processes and products; Strict certification and testing of incoming materials; Fine process control; Multiple factory inspections; Trial production scientific improvement; Efficient after-sales service and continuous optimization, with the aim of customer satisfaction.
      •     Systematic planning;
      •     Strict incoming material control;
      •     Rigorous factory inspection;
      •     Efficient customer service;
      •     Multi party review and supervision;
      •     Scientific trial production improvement
      •     Continuous improvement mechanism;
      •     Data driven decision-making;
      •     Fine process control
      •     Comprehensive development verification
    • 交付服务

      Delivery Service

      We provide one-stop delivery services for chip packaging and testing, covering mainstream fields such as network communication, mobile terminals, high-performance computing, in vehicle electronics, big data storage, artificial intelligence and the Internet of Things, and industrial intelligent manufacturing; Relying on 7× The 24-hour response mechanism and full process traceability system ensure fast, accurate, and reliable delivery of multiple packaging forms, meeting customers' needs for mass production and market launch.  
      •     One stop testing delivery;
      •     Full process traceability system;
      •     Special Plan for Network 
      Communication; 
      •     High performance computing 
      acceleration verification; 
      •     Big data storage reliability testing;
      •     High yield guarantee for mobile terminals;
      •     Vehicle grade AEC-Q100 certification
      •     AIoT+Industrial Intelligent Manufacturing
       Customization Service; 
      •     Compatible with multiple packaging forms;
      •     7× 24-hour rapid response;
    A high-tech company that leads the industry in advanced system level integrated packaging technology, always adheres to breakthroughs and innovations in core capabilities to meet customers' demands for high-end technology.
    03
    application field
    Application Area
    Focusing on providing higher reliability and more customized product solutions for application fields such as artificial intelligence, computing power products, automotive electronics supply chain, industrial control and new energy, and smart wearable devices
    04
    04
    Mobile intelligent terminal
    Providing highly reliable embedded storage packaging for mobile phones and wearable devices, ensuring low power consumption and fast startup.
    移动智能终端
    smart home
    Integrated sensor and storage packaging, enabling IoT devices to operate stably for long periods in complex environments. 
    智能家居
    smart car
    Meets AEC-Q100 automotive-grade standards, provides wide-temperature-range storage and sensor packaging, supports real-time computing for autonomous driving 
    智能汽车
    PC
    Delivering high-capacity FCBGA memory and multi-chip SiP integration solutions for notebook and desktop platforms 
    PC
    data center
    High-density heterogeneous integration technology meets the high-bandwidth and low-latency requirements of server-grade storage modules 
    数据中心
    portable storage
    Integrate packaging, modules, and PCBA into plug-and-play finished products to shorten the time-to-market for UFD and solid-state mobile hard drives 
    移动存储
    About Yixin Micro
    About YCHIPWAY
    05
    Yixinwei Semiconductor Technology (Shenzhen) Co., Ltd. is a solution provider engaged in memory packaging & testing and module manufacturing, sensor packaging & testing and modules, etc. The company is located at 2-5C, Zhongcheng Biomedical Industrial Park, No. 21 Linhui Road, Jinsha Community, Kengzi Street, Pingshan District, Shenzhen, with convenient transportation and a beautiful environment. Since its establishment, the company has actively explored the market, continuously improved its R&D, production, and sales management systems, and is committed to creating an advanced semiconductor chip packaging & testing and module manufacturing enterprise, providing customers with a full-chain "one-stop" solution from chips to finished modules.


    - The company has first-class office and production environments and management levels, with 1,500 square meters of Class 1,000 and 5,000 square meters of Class 10,000 clean rooms.
    - The company has successively passed the ISO9001:2015 Quality Management System, ISO14001 Environmental Management System Certification, ISO45001 Occupational Health and Safety Management System, and IATF16949 International Automotive Industry Quality Management System Standard.
    - The company encourages employees to innovate and develop their individuality in their work, providing excellent talents with broad career opportunities.
    - Yixinwei Semiconductor Technology is a national high-tech enterprise and a national-level "Specialized, Refined, Distinctive, and Innovative" enterprise.
    - Integrated R&D, packaging & testing, and module operations: integrating storage solution R&D, advanced packaging & testing, module assembly testing and services, and brand operations.
    - Self-built advanced packaging & testing and module factories, specializing in memory chip packaging & testing, sensor chip packaging, multi-chip heterogeneous integration, QFN, FCBGA, and SiP, among other advanced packaging & testing fields.
    - Two major product categories: embedded memory packaging & testing and sensor packaging & testing; one distinctive service: packaging + module assembly + PCBA solution finished product testing.

    partner
    Business Partners
    06
    News and Information
    News Center
    07
    Scientific management, sincere service, innovation and improvement, meeting needs; Adhere to regulations and advocate for environmental protection; Ensure safety and maintain a harmonious home.